Description
A strategic and tactical innovator in semiconductor packaging and chip package interaction technologies, Casey became an IBM Fellow in 2013. He contributed to IBM's development of the industry's highest performing organic packaging solutions. These became the basis for all future IBM systems processors, including the most recent p7+ dual-chip module.
Over his career, Casey did groundbreaking work in developing and implementing multilayer ceramic packaging technologies — including the High Performance Glass Ceramic crystallization mechanism, binder removal catalysts, raw material development, and green sheet fabrication — that helped IBM systems lead the industry for more than 20 years. He has served as technology ambassador to Ethiopia.
