Description
The Heat Pipe design effectively directs the heat generated by the chipsets to the heatsink near the back IO ports, where it can be carried away by existing airflow from CPU fan or bundled optional fan. The purpose of the innovative heat pipe design on this motherboard is that the groundbreaking fanless design does not have lifetime problems as a chipset fan does. Furthermore, it provides options for users to install side-flow fan or passive cooler. The Heat Pipe design is the most reliable fanless thermal solution to date.
